Clermont-Ferrand, France

Jean-Raymond Dusseaux

This inventor holds 2 USPTO granted patents and 1 published patent application and 3 EPO patents. Top assignees: Compagnie Generale Des Etablissements Michelin, Michelin Recherche Et Technique S.a.. Active years: 2013-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jean-Raymond Dusseaux. Retrieved from https://idiyas.com/inventor/jean-raymond-dusseaux

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 5(Granted Patents)


Location History:

  • Enval, FR (2013)
  • Clermont-Ferrand, FR (2014)

Company Filing History:


Years Active: 2013-2014

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2 patents (USPTO):Explore Patents

Title: The Innovations of Jean-Raymond Dusseaux

Jean-Raymond Dusseaux is an inventor based in Enval, France. He has made contributions to the field of tire manufacturing through his innovative ideas. Although he currently holds no granted patents, his work reflects a commitment to advancing technology in this area.

Latest Patent Applications

One of his notable patent applications is titled "Lining Assembly on a Skin for a Tire Vulcanization Mould." This invention relates to a lining assembly characterized by a skin that has first and second opposed surfaces. The first surface is intended to be in contact with a support block of a tire mould, while a plurality of lining elements projects from the second surface of the skin. These lining elements are designed to form tread patterns on a portion of a radially external surface of a tire.

Conclusion

Jean-Raymond Dusseaux's innovative approach to tire manufacturing showcases his potential as an inventor. His work, particularly in lining assembly for tire vulcanization, highlights the importance of continuous innovation in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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