This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2002.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2002
Title: Innovations of Jean-Pierre Vidal in Heat Exchanger Technology
Introduction
Jean-Pierre Vidal is a notable inventor based in St Aubin de Medoc, France. He has made significant contributions to the field of heat exchanger technology, particularly through his innovative patent that addresses the challenges of high-temperature applications.
Latest Patents
Vidal holds a patent for a heat exchanger in composite material and the method for making it. This heat exchanger features an intermediate portion made of refractory composite material, such as C/C composite material, which contains fluid circulation channels. This component is strategically placed between a heat shield made of refractory composite material, like C/SiC composite material, and a thermostructural composite material forming the support structure. The assembly of these components is achieved through brazing, making it suitable for use in environments exposed to intense heat flux, such as nuclear fusion reactors or ram jet combustion chambers. He has 1 patent to his name.
Career Highlights
Throughout his career, Jean-Pierre Vidal has focused on developing advanced materials and technologies that enhance the performance and efficiency of heat exchangers. His work has been instrumental in pushing the boundaries of what is possible in high-temperature applications.
Collaborations
Vidal has collaborated with notable professionals in his field, including Jean-Michel Larrieu and Jean-Pierre Ciais. These collaborations have contributed to the advancement of innovative solutions in heat exchanger technology.
Conclusion
Jean-Pierre Vidal's contributions to heat exchanger technology demonstrate his commitment to innovation and excellence. His patent reflects a significant advancement in materials science, particularly for applications requiring high thermal resistance.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile