Eragny, France

Jean-Paul Faure

This inventor holds 3 USPTO granted patents and 1 EPO patent. Top assignees: Vai Clecim, Vai Clecim - Le Polyedre. Active years: 2003-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jean-Paul Faure. Retrieved from https://idiyas.com/inventor/jean-paul-faure-3wy6ooxc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0


Average Co-Inventor Count = 2.0

ph-index = 3

Forward Citations = 18(Granted Patents)


Location History:

  • Eragny sur Oise, FR (2003 - 2004)
  • Eragny/Oise, FR (2004)

Company Filing History:


Years Active: 2003-2004

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3 patents (USPTO):Explore Patents

Title: The Innovations of Jean-Paul Faure

Introduction

Jean-Paul Faure is a notable inventor based in Eragny sur Oise, France. He has made significant contributions to the field of technology, particularly in the area of flatness detection. With a total of three patents to his name, Faure's work has had a meaningful impact on various industries.

Latest Patents

Faure's latest patents include a "Method of and a device for flatness detection" and a "Process for detecting flatness defects." These innovations demonstrate his commitment to advancing technology and improving quality control processes in manufacturing.

Career Highlights

Throughout his career, Jean-Paul Faure has worked with prominent companies such as Vai Clecim and Le Polyedre. His experience in these organizations has allowed him to refine his skills and contribute to important projects in the field.

Collaborations

Faure has collaborated with talented individuals, including Thierry Malard and Remi Perenon. These partnerships have fostered innovation and creativity in his work.

Conclusion

Jean-Paul Faure's contributions to the field of flatness detection through his patents and collaborations highlight his role as an influential inventor. His work continues to inspire advancements in technology and manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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