Jean Desiree Miller

Title: Innovations by Jean Desiree Miller

Introduction

Jean Desiree Miller is a notable inventor based in Bastrop, TX (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that enhances the efficiency of semiconductor packaging.

Latest Patents

Miller holds a patent for a "Packaged semiconductor with multiple rows of bond pads and method therefor." This invention features a semiconductor die with three or more rows of bond pads arranged with minimal pitch. The die is mounted on a package substrate that also has three or more rows of bond fingers and/or conductive rings. The outermost bond pads are connected using a lower height wire through reverse stitching to the innermost ring(s) of bond fingers. The innermost row of bond pads is connected with a higher height wire using ball bond to wedge bond to the outermost row of bond fingers. The intermediate row of bond pads is connected with intermediate height wire, allowing for tightly packed bond pads. This adaptable structure is also suitable for stacked die applications.

Career Highlights

Miller's career has been marked by his work at Motorola Corporation, where he has contributed to various projects in semiconductor technology. His innovative approach has led to advancements that benefit the industry.

Collaborations

Throughout his career, Miller has collaborated with talented individuals such as Shawn M O'Connor and Mark Allen Gerber. These collaborations have fostered an environment of innovation and creativity.

Conclusion

Jean Desiree Miller's contributions to semiconductor technology through his patent demonstrate his expertise and commitment to innovation. His work continues to influence the field and inspire future advancements.