Company Filing History:
Years Active: 2000-2002
Title: The Innovations of Jean Dery
Introduction
Jean Dery is a notable inventor based in Granby, CA. He has made significant contributions to the field of technology, particularly in the development of advanced packaging methods for integrated circuits. With a total of 5 patents to his name, Dery's work has had a substantial impact on the industry.
Latest Patents
Dery's latest patents include a "Thermally Enhanced and Mechanically Balanced Flip Chip Package and Method of Forming." This invention describes a method for creating a flip chip package that maintains flatness over a wide temperature range while providing effective heat dissipation. The process involves using a laminate substrate that is electrically connected to the chip's contacts, with underfill material applied between the soldered connections. Additionally, a body made of uncured dielectric material is applied to the chip and the laminate substrate, ensuring optimal thermal conductivity.
Another significant patent is the "Flip Chip Assembly," which outlines a method for forming a flip-chip-on-board assembly. This method involves joining an integrated circuit (IC) chip to a chip carrier using solder bumps. A plasma treatment is applied to enhance adhesion between the encapsulant and both the IC chip and the chip carrier. This innovative approach improves the overall reliability and performance of the assembly.
Career Highlights
Jean Dery is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to collaborate with some of the brightest minds in the industry, further enhancing his contributions to the field.
Collaborations
Dery has worked alongside talented colleagues such as Luis Jesus Matienzo and Frank Daniel Egitto. Their collaborative efforts have led to advancements in various projects, showcasing the importance of teamwork in the innovation process.
Conclusion
Jean Dery's contributions to the field of technology through his patents and work at IBM highlight his role as a significant inventor. His innovative methods for flip chip packaging and assembly demonstrate the ongoing evolution of integrated circuit technology.