Jean-Christophe Meunier

Title: Jean-Christophe Meunier and High-Frequency Circuit Packaging.

Introduction

Jean-Christophe Meunier is an inventor associated with Limeil-Brévannes, France. His patent work includes a package designed to support very high-frequency integrated circuits.

Latest Patents

Meunier is credited with 1 patent, titled “Package for Very High Frequency Integrated Circuits.” The invention describes a housing with peripheral connectors and a recessed, metallized base. A connection device placed between the integrated circuit and the housing connectors uses microstrip lines on its upper surface and a metallized lower surface that forms a ground plane.

The housing has two parts. The peripheral part accommodates the connectors and a portion of the connection device, while the central part accommodates the integrated circuit and a complementary portion of the connection device. This arrangement allows the package to fit different integrated-circuit dimensions while keeping the connecting wires as short as possible, supporting high-frequency performance.

Career Highlights

Meunier’s listed company affiliation is U.S. Philips Corporation. His patent reflects work on packaging architecture for very high-frequency electronics, with attention to signal connections, grounding, and adaptable housing dimensions.

Collaborations

Patrice Gamand is identified as Meunier’s coworker. The available information does not specify their roles in the patent or describe the nature of their collaboration.

Conclusion

Jean-Christophe Meunier’s patent presents a two-part package design that combines adaptable construction with short electrical connections for very high-frequency integrated circuits.