This inventor holds 1 USPTO granted patent. Top assignee: Anaglobe Technology, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Je-Wei Chuang: Innovator in IC Package Routing
Introduction
Je-Wei Chuang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit (IC) packaging. His innovative approach has led to the development of a unique method for routing redistribution layers in IC packages.
Latest Patents
Je-Wei Chuang holds a patent for a "Method for routing of redistribution layers in IC package." This method is executed by a computer and involves several steps. It includes providing design rules, a set of I/O pads, bump pads, and a pre-assignment netlist. The process performs global routing to generate guides for non-acute angle RDL routing. Additionally, it conducts detailed routing to adjust access points for shorter wire lengths, ultimately finishing the routing by routing nets tile by tile.
Career Highlights
Chuang is currently employed at Anaglobe Technology, Inc., where he continues to innovate in the field of IC packaging. His work has been instrumental in enhancing the efficiency and effectiveness of IC designs.
Collaborations
Some of his notable coworkers include Min-Hsuan Chung and Yao-Wen Chang, who contribute to the collaborative environment at Anaglobe Technology, Inc.
Conclusion
Je-Wei Chuang's contributions to IC package routing exemplify the impact of innovative thinking in technology. His patent reflects a significant advancement in the field, showcasing his expertise and dedication to improving IC design processes.