Seoul, South Korea

Je In Lee

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Seoul National University. Active years: 2021.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Je In Lee - Innovator in High-Entropy Alloy Foam

Introduction

Je In Lee is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of materials science, particularly in the development of high-entropy alloy (HEA) foams. His innovative work has the potential to revolutionize various applications due to the unique properties of HEA materials.

Latest Patents

Je In Lee holds a patent for a "High-entropy alloy foam and manufacturing method for the foam." This invention relates to a HEA foam prepared by selective dissolution of a second phase within a two-phase separating alloy comprising the HEA. The manufacturing method allows for the creation of a novel HEA foam that was previously unavailable. The foam exhibits a structure with pores distributed inside, where at least three metal elements act as a common solvent. This innovation combines low heat conductivity with the existing high strength characteristics of HEA, resulting in excellent physical properties.

Career Highlights

Je In Lee is affiliated with Seoul National University, where he continues to advance research in materials science. His work has garnered attention for its potential applications in various industries, including aerospace and automotive sectors.

Collaborations

He has collaborated with notable colleagues such as Kooknoh Yoon and Eun Soo Park, contributing to the advancement of research in high-entropy alloys.

Conclusion

Je In Lee's innovative work in high-entropy alloy foams showcases his expertise and commitment to advancing materials science. His contributions are paving the way for new applications and improvements in material properties.

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