Cheongju, South Korea

Je Hun Park

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Korloy Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Je Hun Park. Retrieved from https://idiyas.com/inventor/je-hun-park-2w4ywgf2

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Je Hun Park and Wear-Resistant Hard Coatings for Cutting Tools.

Introduction

Je Hun Park is an inventor based in Cheongju, South Korea. He is associated with Korloy Inc. and is named on 1 patent concerning hard coatings for cutting tools.

Latest Patents

Park’s listed patent, “Hard Coating for Cutting Tools with Excellent Wear Resistance,” describes a coating designed to improve wear resistance, oxidation resistance, and hardness. The invention features a hard substrate with a coating made of alternating cubic-structure sub-coatings. One sub-coating uses an aluminum-manganese-nitrogen composition, while the other uses a metal-nitrogen composition, with the metal selected from elements including titanium, chromium, zirconium, hafnium, vanadium, niobium, tantalum, molybdenum, and aluminum.

Career Highlights

Park’s patent work addresses the durability and performance of cutting tools through engineered coating structures. His association with Korloy Inc. connects this work to a company focused on cutting-tool technologies.

Collaborations

Yeong Ju Jo and Hyo Kyeong Kim are identified as Park’s coworkers. The available information does not specify their roles in the patent or whether they collaborated with him on this invention.

Conclusion

Je Hun Park’s listed invention focuses on alternating hard-coating layers intended to enhance cutting-tool wear resistance, oxidation resistance, and hardness.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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