Harrison, NJ, United States of America

Jayant Chandrakant Bhosle

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Service Support Specialties, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jayant Chandrakant Bhosle. Retrieved from https://idiyas.com/inventor/jayant-chandrakant-bhosle

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jayant Chandrakant Bhosle: Semiconductor Processing and Robotics

Introduction

Jayant Chandrakant Bhosle is an inventor associated with Harrison, New Jersey, and Service Support Specialties, Inc. His patent work concerns semiconductor processing and robotic equipment designed to handle substrates.

Latest Patents

Bhosle is named on 1 patent: “Method and/or System for Processing a Substrate and Robot Apparatus Therefor.” The patent describes a semiconductor processing system, a method for processing semiconductors, and a robot apparatus. The apparatus includes a support structure and two spaced-apart movable arms, each equipped with two end effectors. Separate drive mechanisms move the arms along their respective axes, while another mechanism moves both arms along a perpendicular third axis. This arrangement is intended to support substrate handling within semiconductor processing operations.

Career Highlights

Bhosle’s listed invention focuses on coordinating multiple robot arms and end effectors across different axes. The design addresses the movement and handling requirements of semiconductor substrates during processing.

Collaborations

Gary Hillman and Matthew Hoffer are identified as Bhosle’s coworkers. The patent record provided does not specify their roles in the invention.

Conclusion

Jayant Chandrakant Bhosle’s patent work centers on robotic substrate handling for semiconductor processing, combining multiple arms and coordinated movement to support manufacturing operations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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