Jay M Cech

Title: Innovations by Jay M Cech

Introduction

Jay M Cech is a notable inventor based in Elmhurst, IL (US). He has made significant contributions to the field of integrated circuits, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of semiconductor technology.

Latest Patents

One of Jay M Cech's latest patents is titled "Thin-film electrical connections for integrated circuits." This patent describes a method for fabricating thin-film multilayer interconnect signal planes for connecting semiconductor integrated circuits. In this innovative method, a first pattern of thin-film metallic interconnect lines is formed on a substrate's surface. Subsequently, a dielectric layer is applied over the entire surface, covering the thin-film metallic interconnect lines. A portion of this dielectric layer is then removed to expose the interconnect lines, creating a series of trenches above each line. The interconnect lines are electroplated to form thicker metal interconnect lines, resulting in a substantially planar surface. This process can be repeated to create multiple interconnect signal planes, with metallic vias provided between each layer for electrical connections.

Career Highlights

Jay M Cech is associated with Gould Inc., where he has been instrumental in advancing semiconductor technologies. His expertise in thin-film technology has positioned him as a key player in the field.

Collaborations

Throughout his career, Jay has collaborated with notable colleagues, including Peter L Young and Kin Li. These collaborations have further enriched his work and contributed to the development of innovative solutions in integrated circuits.

Conclusion

Jay M Cech's contributions to the field of integrated circuits through his patents and collaborations highlight his role as a significant inventor. His innovative methods continue to influence the advancement of semiconductor technology.