Company Filing History:
Years Active: 2000-2002
Title: Jay Greenspan: Innovator in Hermetic Technologies
Introduction
Jay Greenspan, a talented inventor based in South Dartmouth, MA, holds two patents that showcase his innovative spirit and dedication to advancing technology. His work primarily focuses on hermetic lead structures and high-performance power semiconductor modules, reflecting the importance of reliability in electronic designs.
Latest Patents
One of Jay's notable inventions is the "Low Resistance Hermetic Lead Structure." This invention provides a lead structure featuring a lead made of low resistance material, such as copper, which is encased in a surrounding sleeve or collar of low expansion material, typically a nickel-alloy. The design ensures that the lead is hermetically sealed within the sleeve and the sleeve is also hermetically sealed to an insulating wall, thus allowing high conductivity electrical lead materials to function effectively in a sealed environment. Multiple lead structures can be employed in the walls of a circuit package, showcasing versatility in electronic applications.
His second patent, the "Power Semiconductor Module," describes an electronic module that emphasizes high reliability and performance. The package consists of a hermetically sealed enclosure with a metallic baseplate and a ceramic cover, housing circuits often comprising power rectifiers or control circuitry. It features a terminal block that provides hermetically sealed power terminals and may accommodate additional signal or control terminals, adaptable to varying user requirements without demanding modifications to the module’s terminal configuration.
Career Highlights
Jay has made significant contributions while working for various organizations, including Omnirel LLC and Ixion, Inc. His experience in these companies has helped him refine his skills in electronic packaging solutions and hermetic technologies, aligning with his inventive pursuits.
Collaborations
Throughout his career, Jay has worked alongside renowned professionals such as John Catrambone and David Doiron. These collaborations have likely enriched his knowledge base and propelled his innovations further, fostering an environment of shared expertise that enhances the quality of his inventions.
Conclusion
In summary, Jay Greenspan stands out as an influential figure in the realm of hermetic technologies and electronic packaging. His patented inventions not only illustrate his innovative capabilities but also contribute significantly to advancements in reliable electronic systems. With a foundation in collaboration and a commitment to excellence, Jay continues to pave the way for future developments in this critical field.