Ixion, Inc.

Omnirel LLC

Jay Greenspan

David Doiron

Boris Semenov

William Driscoll

John Catrambone

Christopher Clarke

The invention provides a lead structure having a lead of low resistance material disposed within a surrounding sleeve or collar of low expansion material which is bonded at one end to the lead. The sleeve or collar is bonded on its outer surface to an insulating wall through which the lead structure extends. The lead is preferably copper and the sleeve or collar is preferably a nickel-alloy. The lead is hermetically sealed to the surrounding sleeve, and the sleeve is hermetically sealed to the insulating wall to provide a hermetic structure which does not detract from the use of high conductivity electrical lead materials which are often not employable in conventional hermetic sealed leads or packages. A plurality of lead structures can be employed in one or more walls of a circuit package.

Low resistance hermetic lead structure

An electronic module or package is disclosed for providing high reliability and high performance operation. The package comprises a hermetically sealed enclosure having a metallic baseplate and a ceramic cover, and containing one or more circuits or devices therein which typically are power rectifiers, bridges or power control circuitry. One or more power terminals are disposed on a terminal block compliantly supported on or above the baseplate, the terminals extending through the cover in hermetically sealed manner. Signal or control terminals may also be disposed on a terminal block compliantly supported on or above the baseplate, these terminals also extending through the cover in hermetically sealed manner. An adapter plate may be mounted on the cover and containing a plurality of terminals connected to the module terminals. The terminals of the adapter plate can be in any configuration to suit user requirements without requiring a change in the terminal configuration of the module itself. The adapter plate may also contain active and/or passive circuitry.

Power semiconductor module

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South Dartmouth, MA, United States of America

Jay Greenspan