Company Filing History:
Years Active: 2001-2002
Title: Innovative Contributions of Jaw-Shiun Hsieh in Semiconductor Technology
Introduction
Jaw-Shiun Hsieh, a notable inventor based in Kaohsiung, Taiwan, has made significant strides in the field of semiconductor technology. With a total of two patents to his name, Hsieh's innovative work has contributed greatly to advancements in the industry, particularly in methods that enhance the efficiency and effectiveness of various semiconductor processes.
Latest Patents
Hsieh's latest patents showcase his expertise in laser methods and wire bonding technologies. One of his notable inventions is the "Laser Method for Forming Vias." This innovative method involves several steps, including providing a heat sink and locally oxidizing its surface into a copper oxide film. By bonding a substrate onto the heat sink at specific locations and utilizing laser beams to remove exposed copper oxide, Hsieh's technique facilitates the formation of a plurality of vias through the disposal of solder balls. This method significantly improves the manufacturing process of semiconductor devices.
Another patent, titled "Structure of a Ball Bump for Wire Bonding and the Formation Thereof," addresses the design and formation of ball bumps used in wire bonding. This invention details a process where a wire held by a bonding machine is melted to form a ball, which is then bonded to a bonding pad. Hsieh's design incorporates a protrusion that consists of a flat upper surface with an annular inclination, providing a more efficient connection area for wire bonding.
Career Highlights
Jaw-Shiun Hsieh is currently associated with Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His work has emphasized innovation in semiconductor processes, reflecting his dedication to enhancing device performance and manufacturing efficiency. Hsieh's achievements illustrate his commitment to advancing technology in the field, making him a key figure among fellow inventors.
Collaborations
Throughout his career, Hsieh has collaborated with talented professionals such as Yu-Fang Tsai and Chun-Chi Lee. These collaborations not only highlight the importance of teamwork in innovative endeavors but also demonstrate the collective effort required to push the boundaries of semiconductor technology.
Conclusion
In conclusion, Jaw-Shiun Hsieh's contributions to the semiconductor industry through his innovative patents are invaluable. His work, particularly in developing advanced methods for forming vias and wire bonding, stands as a testament to his ingenuity and professionalism. As semiconductor technology continues to evolve, Hsieh's inventions will undoubtedly leave a lasting impact on the field.