Company Filing History:
Years Active: 2020-2021
Title: Jason Schipp: Innovator in 3D Conductive Constructs
Introduction
Jason Schipp is a notable inventor based in Jasper, Indiana, known for his contributions to the field of 3D printing and conductive materials. With a total of 2 patents, Schipp has made significant strides in developing innovative methods for constructing conductive materials in three-dimensional geometries.
Latest Patents
One of Schipp's latest patents is focused on a catalyst ink for three-dimensional conductive constructs. This method involves the selective application of an aerosol-based colloidal solution containing catalytic palladium nanoparticle material onto a substrate. Following this, the coated substrate is immersed in an electro-less plating bath for the deposition of conductive copper material. The process can be repeated to create arbitrary 3D geometric constructs that contain intricate conductive metallic patterns.
Career Highlights
Jason Schipp is currently employed at Science Applications International Corporation, where he continues to push the boundaries of innovation in his field. His work has garnered attention for its potential applications in various industries, particularly in enhancing the capabilities of 3D printing technologies.
Collaborations
Some of Schipp's notable coworkers include David M. Morris and John Philip Timler, who contribute to the collaborative environment that fosters innovation at Science Applications International Corporation.
Conclusion
In summary, Jason Schipp is a pioneering inventor whose work in 3D conductive constructs is shaping the future of material science and engineering. His innovative methods and collaborative efforts are paving the way for advancements in 3D printing technologies.