The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Mar. 19, 2020
Applicant:
Science Applications International Corporation, Reston, VA (US);
Inventors:
David Morris, Bloomington, IN (US);
John Timler, River Ridge, LA (US);
Jason Schipp, Jasper, IN (US);
Assignee:
Science Applications International Corporation, Reston, VA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/03 (2014.01); C23C 18/16 (2006.01); C23C 18/38 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 40/00 (2020.01); B82Y 30/00 (2011.01);
U.S. Cl.
CPC ...
C09D 11/03 (2013.01); C23C 18/161 (2013.01); C23C 18/1637 (2013.01); C23C 18/1662 (2013.01); C23C 18/38 (2013.01); B33Y 10/00 (2014.12); B33Y 40/00 (2014.12); B33Y 70/00 (2014.12); B82Y 30/00 (2013.01);
Abstract
A method of constructing conductive material in arbitrary three-dimensional (3D) geometries, such as 3D printing. The method may include selective application of an aerosol-based colloidal solution containing a catalytic palladium nanoparticle material onto a substrate and then immersion of the coated substrate into an electro-less plating bath for deposition of conductive copper material. The above steps may be repeated to create arbitrary 3D geometric constructs containing conductive metallic patterns.