Company Filing History:
Years Active: 2022-2025
Title: Jason Huang - Innovator in Semiconductor Technology
Introduction
Jason Huang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on improving interconnect structures, which are crucial for the performance of semiconductor devices.
Latest Patents
One of Jason Huang's latest patents is titled "Low resistance interconnect structure for semiconductor device." This patent describes an innovative interconnect structure and a method for forming it. The interconnect structure includes a substrate, a layer of conductive material over the substrate, a metallic capping layer over the conductive material, a layer of insulating material covering the top and side surfaces of the metallic capping layer, and a layer of trench conductor formed within the insulating material and the metallic capping layer. This design aims to enhance the efficiency and performance of semiconductor devices.
Career Highlights
Jason Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approach have positioned him as a valuable asset to the company.
Collaborations
Throughout his career, Jason has collaborated with notable colleagues, including Liang-Chor Chung and Cheng-Yuan Li. These partnerships have contributed to the advancement of semiconductor technologies and innovations.
Conclusion
In summary, Jason Huang is a dedicated inventor whose work in semiconductor technology has led to significant advancements. His patents reflect his commitment to innovation and excellence in the field.