Waterford, MI, United States of America

Jason Gorski

This inventor holds 1 USPTO granted patent. Top assignee: Orthodynamics Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jason Gorski. Retrieved from https://idiyas.com/inventor/jason-gorski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jason Gorski and an Implantable Bone Growth Stimulator.

Introduction

Jason Gorski is an inventor based in Waterford, Michigan. His work includes an implantable bone growth stimulator designed to deliver electrical energy to a targeted area of bone.

Latest Patents

Gorski is associated with 1 patent, titled “Implantable Bone Growth Stimulator.” The device uses an antenna to receive radio-frequency electromagnetic signals and a controller with a supercapacitor that stores energy from those signals. An anode and a cathode extend from the controller, with the cathode positioned at the desired bone-growth site. Electrical energy traveling between the electrodes is intended to stimulate bone growth in a patient.

Career Highlights

Gorski is associated with Orthodynamics GmbH. His patent describes an approach that combines wireless energy reception and storage with electrical stimulation at the treatment site.

Collaborations

The provided information identifies John Gorski and Daniel J. Mastella as Gorski’s coworkers. Their specific roles in the patent or related work are not stated.

Conclusion

Jason Gorski’s patent focuses on an implantable, wirelessly powered device for stimulating bone growth, reflecting his contribution to medical-device innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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