This inventor holds 2 USPTO granted patents. Top assignee: Trw Limited. Active years: 1999-2000.
Company Filing History:
Years Active: 1999-2000
Title: Jason E Snodgress: Innovator in Microwave Module Packaging
Introduction
Jason E Snodgress is a notable inventor based in Playa Del Rey, California. He has made significant contributions to the field of microwave module packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
One of his latest patents is focused on low-cost hermetic sealed microwave module packaging. This invention relates to a method for producing low-cost hermetic Integrated Module Assembly (IMA) packaging. In this process, an aluminum coating is deposited on a poly-tetrafluoral-ethaline substrate. The aluminum coating is selectively etched to form a waveguide window, and the substrate is treated over the waveguide window to produce a non-conductive hermetic seal. The substrate is then joined to a metal carrier containing the waveguide. This innovative method allows for the use of selectively treated low-cost substrates to produce hermetic seals, eliminating the need for more expensive substrates in forming hermetic seals over substrate to waveguide interconnections.
Career Highlights
Jason E Snodgress is currently employed at TRW Limited, where he continues to develop and refine his inventions. His work has been instrumental in advancing microwave technology and improving packaging methods.
Collaborations
Throughout his career, Jason has collaborated with notable colleagues, including Steven S Chan and John E Dowsing, III. These collaborations have contributed to the success of his projects and innovations.
Conclusion
Jason E Snodgress is a prominent inventor whose work in microwave module packaging has made a significant impact in the field. His innovative methods and collaborations continue to drive advancements in technology.