Oulu, Finland

Jarmo Konu


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: Jarmo Konu: Innovator in Mobile Device Technology

Introduction

Jarmo Konu is a notable inventor based in Oulu, Finland. He has made significant contributions to the field of mobile device technology, particularly in grounding methods and apparatus. His innovative approach has led to the development of a unique patent that enhances the functionality of mobile devices.

Latest Patents

Jarmo Konu holds a patent for "Capacitive grounding methods and apparatus for mobile devices." This patent describes a grounding apparatus for mobile devices and methods of utilizing and manufacturing the same. In one embodiment, an outer metallized surface of a mobile device is configured to capacitively couple a metal back cover to the device ground. Specifically, in one implementation, an exterior surface of the mobile device is metalized and coupled to the device ground via galvanic contacts. The exterior metalized surface is designed to capacitively couple a metal back cover of a mobile device to the device ground when the back cover is installed. By capacitively coupling the back cover to the device ground via the exterior metalized surface, the need to otherwise ground the back cover through the use of galvanic contacts is eliminated, thereby reducing the number of components needed. Jarmo Konu has 1 patent to his name.

Career Highlights

Jarmo Konu is currently employed at Pulse Finland Oy, where he continues to innovate in the mobile technology sector. His work focuses on improving the efficiency and functionality of mobile devices through advanced grounding techniques.

Collaborations

Some of his coworkers include Prasadh Ramachandran and Petteri Annamaa, who contribute to the innovative environment at Pulse Finland Oy.

Conclusion

Jarmo Konu's contributions to mobile device technology through his patent on capacitive grounding methods demonstrate his commitment to innovation. His work not only enhances device functionality but also streamlines manufacturing processes.

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