Toledo, OH, United States of America

Jared R Pack

This inventor holds 1 USPTO granted patent. Top assignee: The University of Toledo. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jared R Pack. Retrieved from https://idiyas.com/inventor/jared-r-pack

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Innovations by Jared R Pack in Spinal Fixation Technology.

Introduction

Jared R Pack is an accomplished inventor based in Toledo, OH (US). He has made significant contributions to the field of spinal fixation technology. His innovative work focuses on enhancing the stability and effectiveness of spinal devices.

Latest Patents

Jared R Pack holds a patent for a "Stabilized spinal fixation device." This device includes a body designed for implantation in a human body and features a clamp made from shape memory material, which is attached to the device body. This innovation aims to improve the outcomes of spinal surgeries.

Career Highlights

Jared R Pack is affiliated with the University of Toledo, where he continues to advance his research and development in medical devices. His work is pivotal in addressing challenges faced in spinal surgeries, contributing to better patient care.

Collaborations

Some of his notable coworkers include John R D'Onofrio and Vijay K Goel. Their collaborative efforts enhance the research environment and foster innovation in spinal fixation technologies.

Conclusion

Jared R Pack's contributions to spinal fixation technology exemplify the impact of innovative thinking in the medical field. His patent for a stabilized spinal fixation device represents a significant advancement in improving surgical outcomes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…