Rochester, NY, United States of America

Janet Heyen

USPTO Granted Patents = 1 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Janet Heyen

Introduction

Janet Heyen is a notable inventor based in Rochester, NY (US). She has made significant contributions to the field of printed circuit board technology. Her innovative methods have paved the way for advancements in electronic manufacturing.

Latest Patents

Janet holds a patent for a "Method for forming vias on printed circuit boards." This method involves formulating a paste as a dispersion of copper particulate, which includes nanocopper particles in a solvent and a binder. The paste is deposited into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent, and the method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper. This innovative approach enhances the efficiency and effectiveness of printed circuit board production.

Career Highlights

Janet is currently employed at Intrinsiq Materials Limited, where she continues to develop and refine her innovative techniques. Her work has been instrumental in advancing the capabilities of printed circuit boards, making them more efficient and reliable.

Collaborations

Janet collaborates with her coworker, David Ciufo, to further enhance their research and development efforts. Together, they work on innovative solutions that push the boundaries of technology in their field.

Conclusion

Janet Heyen's contributions to the field of printed circuit boards exemplify her dedication to innovation and excellence. Her patented methods are a testament to her expertise and commitment to advancing technology.

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