The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2018
Filed:
Nov. 03, 2015
Applicant:
Intrinsiq Materials, Inc., Rochester, NY (US);
Inventors:
David Ciufo, Hilton, NY (US);
Janet Heyen, Rochester, NY (US);
Assignee:
Intrinsiq Materials, Inc., Rochester, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/40 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/22 (2006.01); H05K 3/26 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4069 (2013.01); H05K 1/032 (2013.01); H05K 1/0306 (2013.01); H05K 1/097 (2013.01); H05K 3/0047 (2013.01); H05K 3/1233 (2013.01); H05K 3/227 (2013.01); H05K 3/26 (2013.01); H05K 3/429 (2013.01); H05K 3/4617 (2013.01); H05K 2201/0266 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/09536 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/085 (2013.01); H05K 2203/086 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1131 (2013.01); H05K 2203/143 (2013.01); H05K 2203/1438 (2013.01); Y10T 29/49165 (2015.01);
Abstract
A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper.