Company Filing History:
Years Active: 2018
Title: The Innovative Contributions of David Ciufo
Introduction
David Ciufo is an accomplished inventor based in Hilton, NY (US). He has made significant contributions to the field of printed circuit board technology. His innovative approach has led to the development of a unique method for forming vias on printed circuit boards.
Latest Patents
Ciufo holds a patent for a method that involves filling a via on a printed circuit board. This method formulates a paste as a dispersion of copper particulate, which includes nanocopper particles in a solvent and a binder. The paste is deposited into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent, and the method sinters the deposited paste in the via cavity. It also planarizes the sintered via and overplates the filled via with copper. Ciufo's patent is a testament to his innovative thinking and technical expertise, with 1 patent to his name.
Career Highlights
David Ciufo is currently employed at Intrinsiq Materials Limited, where he continues to push the boundaries of technology in his field. His work has garnered attention for its practical applications and potential to enhance the performance of electronic devices.
Collaborations
Ciufo collaborates with talented professionals, including his coworker Janet Heyen. Their combined efforts contribute to the advancement of technology in printed circuit board manufacturing.
Conclusion
David Ciufo's innovative methods and dedication to his work have made him a notable figure in the field of printed circuit boards. His contributions continue to influence the industry and pave the way for future advancements.