Völklingen, Germany

Jürgen Peter Turnsek


Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Völkingen, DE (2002)
  • Völklingen, DE (2004)

Company Filing History:


Years Active: 2002-2004

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2 patents (USPTO):

Title: Jürgen Peter Turnsek: Innovator in Active Brazing Solder Technology

Introduction

Jürgen Peter Turnsek is a notable inventor based in Völklingen, Germany. He has made significant contributions to the field of brazing technology, particularly in the development of active brazing solders for alumina-ceramic parts. With a total of 2 patents, his work has advanced the capabilities of ceramic bonding in various applications.

Latest Patents

Turnsek's latest patents focus on an active brazing solder designed for high-purity alumina ceramic parts. This innovative solder contains a maximum of 12 wt. % titanium, 8 wt. % beryllium, and less than 16.5 wt. % iron, with zirconium and impurities making up the remainder. The solder exhibits several remarkable features, including a brazing temperature lower than 1,000 °C, high-vacuum-tight joints over extended periods, and a coefficient of thermal expansion that closely matches that of alumina ceramics throughout the brazing process. The strength of the brazed joint is so robust that fractures occur in the adjacent ceramic rather than at the joint itself. Additionally, the pressure resistance of the solder exceeds 2 GPa, and it can be processed into powders with particle sizes around 10 µm.

Career Highlights

Throughout his career, Turnsek has worked with reputable companies, including Endress + Hauser GmbH + Co. His expertise in brazing technology has positioned him as a key figure in the development of advanced materials for industrial applications.

Collaborations

Some of his notable coworkers include Frank Hegner and Elke Maria Schmidt. Their collaborative efforts have contributed to the success of various projects in the field of brazing technology.

Conclusion

Jürgen Peter Turnsek's innovative work in active brazing solder technology has significantly impacted the field of ceramic bonding. His patents reflect a commitment to advancing materials science and engineering, ensuring high-performance solutions for industrial applications.

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