Leuven, Belgium

Jan Vaes

USPTO Granted Patents = 1 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 506(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: Jan Vaes - Innovator in Semiconductor Technology

Introduction

Jan Vaes is a notable inventor based in Leuven, Belgium. He has made significant contributions to the field of semiconductor technology, particularly in the production of interconnect structures for integrated circuits. His innovative methods have the potential to enhance the efficiency and performance of semiconductor devices.

Latest Patents

Jan Vaes holds a patent for a "Method for producing interconnect structures for integrated circuits." This patent outlines a comprehensive process for creating semiconductor devices. The method involves several steps, including providing a semiconductor substrate with active components, depositing a dielectric material, etching openings, and filling these openings with conductive materials. The process also includes a common CMP stopping layer to streamline the manufacturing steps. This innovation is crucial for improving the fabrication of integrated circuits.

Career Highlights

Jan Vaes is associated with Imec, a leading research and innovation hub in nanoelectronics and digital technologies. His work at Imec has positioned him at the forefront of semiconductor research, allowing him to contribute to advancements in the industry. His expertise in semiconductor device fabrication is recognized and valued within the research community.

Collaborations

Jan Vaes has collaborated with notable colleagues, including Cedric Huyghebaert and Jan Van Olmen. These collaborations have fostered a productive environment for innovation and have led to significant advancements in semiconductor technology.

Conclusion

Jan Vaes is a prominent figure in the field of semiconductor technology, with a focus on innovative methods for producing interconnect structures. His contributions through patents and collaborations continue to shape the future of integrated circuits.

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