The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2012
Filed:
Dec. 01, 2009
Cedric Huyghebaert, Leuven, BE;
Jan Vaes, Leuven, BE;
Jan Van Olmen, Boutersem, BE;
IMEC, Leuven, BE;
Abstract
The present disclosure is related to method for producing a semiconductor device comprising the steps of: providing a semiconductor substrate (), comprising active components on the surface of said substrate, depositing a top layer () of dielectric material on the surface of said substrate or on other dielectric layers present on said surface, etching at least one first opening () at least through said top layer, filling said opening(s) at least with a first conductive material (), and performing a first CMP step, to form said first conductive structures (), etching at least one second opening () at least through said top layer, filling said opening(s) at least with a second conductive material (), and performing a second CMP step, to form said second conductive structures (), wherein the method comprises the step of depositing a common CMP stopping layer () on said dielectric top layer, before the steps of etching and filling said first opening(s), so that said same CMP stopping layer is used for stopping the CMP process after filling of the first opening(s) as well as the CMP process after filling of the second opening(s). The disclosure is equally related to devices obtainable by the method of the disclosure.