This inventor holds 1 USPTO granted patent. Top assignee: Wacker-Chemie Gmbh. Active years: 1985.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1985
Title: Jan Stodulka: Innovator in Semiconductor Packaging
Introduction
Jan Stodulka is a notable inventor based in Tittmoning, Germany. He has made significant contributions to the field of semiconductor packaging, showcasing his innovative spirit and technical expertise. His work is particularly recognized for its practical applications in the semiconductor industry.
Latest Patents
Jan Stodulka holds a patent for a packaging unit designed specifically for semiconductor wafers. This invention is a three-component tray-type packaging unit that is compatible with automatic equipment. The design includes a wafer carrier that is enclosed between a tub-shaped lower portion for receiving the wafer carrier and a matching lid. The wafers are securely fixed at four contact points, utilizing two rows of spring tongues arranged tangentially with respect to the wafer in the wafer carrier, and two rows of inwardly projecting retention cones in the matching lid. This innovative packaging solution enhances the efficiency and safety of semiconductor wafer handling.
Career Highlights
Jan Stodulka is currently employed at Wacker-Chemie GmbH, a leading company in the chemical industry. His role at the company allows him to apply his inventive skills and contribute to advancements in semiconductor technology. His dedication to innovation has positioned him as a valuable asset in his field.
Collaborations
Throughout his career, Jan has collaborated with talented individuals such as Jurgen Voss and Otto Dombkowski. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Jan Stodulka's contributions to semiconductor packaging exemplify the impact of innovation in technology. His patent for a packaging unit for semiconductor wafers demonstrates his commitment to enhancing industry standards. His work continues to influence the field, paving the way for future advancements.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
