Cologne, Germany

Jan Michael Rittmann

This inventor holds 1 USPTO granted patent. Top assignee: Ford Global Technolgoies, LLC. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jan Michael Rittmann. Retrieved from https://idiyas.com/inventor/jan-michael-rittmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Jan Michael Rittmann: Inventor of a Sound-Absorbing Load Compartment Cover.

Introduction

Jan Michael Rittmann is an inventor associated with Cologne, Germany, and Ford Global Technologies, LLC. His patent work includes an automotive load compartment cover designed to absorb sound while remaining practical to handle.

Latest Patents

Rittmann is listed with 1 patent: “Load compartment cover having sound-absorbing characteristics.” The invention concerns a cover positioned above the base of a vehicle’s load compartment, between the rear seats and the tailgate. It uses two thin, spaced-apart sheets with micro-perforations and a single air cushion between them. The sound-absorbing partition is designed to reduce noise while avoiding disadvantages associated with conventional load compartment covers.

Career Highlights

Rittmann’s documented patent contribution focuses on combining acoustic performance with practical use in vehicle interiors. The design’s layered construction and perforations form the central features of the patented approach.

Collaborations

The patent information identifies Ford Global Technologies, LLC, as the associated company and Andreas Bock as a coworker.

Conclusion

Jan Michael Rittmann’s recorded invention applies a layered, micro-perforated structure to make an automotive load compartment cover sound-absorbing and practical.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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