Aachen, Germany

Jan Derksen

This inventor holds 1 USPTO granted patent. Top assignee: Rwth Aachen. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jan Derksen. Retrieved from https://idiyas.com/inventor/jan-derksen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jan Derksen: Inventor in Soil Reinforcement

Introduction

Jan Derksen is an inventor associated with Aachen, Germany, and RWTH Aachen. His work includes an invention for strengthening soil areas, ground surfaces, and earthwork structures.

Latest Patents

The provided information lists one patent for Jan Derksen: “Reinforcement and Method for Operating Same.” The invention describes a reinforcement system with one or more reinforcement elements, which may intersect at an angle. At least one element includes an actuator that can change a property of the element, temporarily or otherwise. The patent also addresses structures built on subsoil and methods for operating the reinforcement. The supplied data reports 1 patent.

Career Highlights

Derksen is associated with RWTH Aachen. The available information identifies his patent work in the field of soil reinforcement but does not provide further details about his role or career history.

Collaborations

The supplied information names Raul Fuentes Gutierrez as a coworker. It does not specify the nature of their collaboration.

Conclusion

Jan Derksen’s listed invention focuses on adaptable reinforcement for soil and earthwork structures, connecting his patent activity with his association with RWTH Aachen.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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