Company Filing History:
Years Active: 2001
Title: Innovations by Jamin Ling in Integrated Circuit Metallization
Introduction
Jamin Ling is an accomplished inventor based in Westboro, MA (US). He has made significant contributions to the field of semiconductor technology, particularly in the area of integrated circuit metallization. With a total of 2 patents to his name, Ling's work has advanced the efficiency and reliability of electronic devices.
Latest Patents
One of Jamin Ling's notable patents is a method for forming planarized multilevel metallization in an integrated circuit. This innovative method allows for the creation of multilevel metallization through a planar process at each layer. The technique enables minimum widths of lines and vias, as well as minimal lateral spacing between lines. Conductive lines and contacts are formed prior to planarization, ensuring good step coverage. The process begins with the deposition of aluminum over the integrated circuit, followed by patterning and etching to create metal interconnect lines. Regions of planar insulating material are then established between the metal lines. A second layer of aluminum is deposited and etched to form metal vias over selected portions of the metal lines, using a reverse pattern of the initial metal lines. This meticulous approach results in aluminum lines and vias that are free of voids, provide excellent step coverage, and minimize electromigration issues.
Career Highlights
Jamin Ling is currently employed at STMicroelectronics GmbH, where he continues to innovate in the semiconductor industry. His expertise in integrated circuit design and metallization processes has positioned him as a valuable asset to his team and the company.
Collaborations
Throughout his career, Jamin Ling has collaborated with esteemed colleagues such as Kuei-Wu Huang and Tsiu Chiu Chan. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Jamin Ling's contributions to the field of integrated circuit metallization exemplify the impact of innovative thinking in technology. His patents reflect a commitment to enhancing the performance and reliability of electronic devices.