Oxford, MI, United States of America

Jamie Mleczko

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Aptiv Technologies Ag. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jamie Mleczko. Retrieved from https://idiyas.com/inventor/jamie-mleczko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

 

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Jamie Mleczko and Vehicle Electronics Innovation.

Introduction

Jamie Mleczko is an inventor associated with Oxford, Michigan, and Aptiv Technologies AG. His patent work includes a vehicle electronics housing design with a self-retaining feature for securing the module to a substrate.

Latest Patents

Mleczko is named on one patent: “Electronic Module with Self-Retaining Feature and Method of Using Same.” The invention describes an electronic housing module designed to contain vehicle components. A flange secures the module to a substrate, and an aperture in the flange holds a metal cylinder with inward-extending deformable features. A threaded stud passes through the cylinder, where a nut secures the assembly. This arrangement provides a self-retaining feature for mounting the electronic module. Mleczko’s listed portfolio includes 1 patent.

Career Highlights

Mleczko’s documented patent contribution focuses on vehicle electronics packaging and mounting. The design combines a housing module, flange, metal cylinder, deformable features, threaded stud, and nut to support attachment to a substrate. His company affiliation is Aptiv Technologies AG.

Collaborations

Mleczko’s listed coworkers include David Siener and Ayush Lal. The available information identifies them as coworkers but does not specify their roles in the patent or the invention.

Conclusion

Jamie Mleczko’s patent work addresses a practical vehicle engineering challenge by describing a self-retaining mounting feature for an electronic housing module.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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