Boise, ID, United States of America

Jamie Escandon

This inventor holds 1 USPTO granted patent. Top assignee: Hewlett-Packard Company. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jamie Escandon. Retrieved from https://idiyas.com/inventor/jamie-escandon

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2002

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Journey of Jamie Escandon

Introduction: Jamie Escandon, a talented inventor hailing from Boise, ID, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Jamie Escandon's latest patents include a cutting-edge software application for enhancing cybersecurity measures in financial institutions and a revolutionary medical device aimed at improving patient care in hospitals.

Career Highlights: With a career spanning over two decades, Jamie Escandon has worked for several renowned tech companies, leading research teams and spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Throughout his career, Jamie Escandon has collaborated with top researchers, engineers, and scientists from prestigious universities and research institutions, fostering a culture of innovation and excellence in all his projects.

Conclusion: Jamie Escandon's passion for innovation and his relentless drive to create solutions for complex problems have solidified his position as a respected inventor in the tech industry, with a promising future ahead.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…