This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: The Boeing Company. Active years: 2025.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025
Title: Innovations of James W. Peck in Sound-Attenuating Heat Exchangers
Introduction
James W. Peck is an accomplished inventor based in West Lafayette, IN (US). He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on sound-attenuating heat exchangers, which play a crucial role in various industrial applications.
Latest Patents
James W. Peck holds a patent for "Sound-attenuating heat exchangers and methods of exchanging heat and attenuating sound within sound-attenuating heat exchangers." This invention includes a base region that defines a first base side and a second base side, along with a plurality of elongate fluid conduits designed to contain a cooled fluid stream. The heat exchangers also feature heat transfer-enhancing structures that extend from the first base side to exchange thermal energy with a cooling fluid stream. Additionally, a sound-attenuating region extends from the second base side, incorporating resonator cells that are configured to attenuate sound.
Career Highlights
James W. Peck is currently employed at The Boeing Company, where he applies his expertise in thermal management and sound attenuation. His innovative approach has led to advancements in the efficiency and effectiveness of heat exchangers used in various applications.
Collaborations
James has collaborated with notable colleagues, including Justin Honshune Lan and Derek William Flett. Their combined efforts contribute to the ongoing development of innovative solutions in the field of thermal management.
Conclusion
James W. Peck's contributions to sound-attenuating heat exchangers demonstrate his commitment to innovation and excellence in engineering. His work not only enhances thermal efficiency but also addresses sound attenuation, making significant strides in industrial applications.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
