James V Ellerson

Title: The Innovations of James V Ellerson

Introduction

James V Ellerson is a notable inventor based in Endicott, NY (US). He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work primarily focuses on the interconnection of semiconductor devices, which is crucial for the advancement of electronic components.

Latest Patents

One of his latest patents involves the interconnection of a carrier substrate and a semiconductor device. This patent describes a solder interconnection that forms connections between an integrated semiconductor device and a carrier substrate. The design includes electrodes located on the carrier substrate, with solder connections positioned between the electrodes and the integrated semiconductor device. These solder connections have a relatively low melting point, allowing them to liquify during operation. This feature permits expansion compensation between the substrate and the semiconductor device, enhancing the reliability and performance of electronic devices.

Career Highlights

James V Ellerson is associated with the International Business Machines Corporation (IBM), where he has contributed to various innovative projects. His expertise in semiconductor technology has positioned him as a key player in the development of advanced electronic systems.

Collaborations

Throughout his career, Ellerson has collaborated with notable colleagues, including Jack A Varcoe and Joseph Funari. These collaborations have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.

Conclusion

James V Ellerson's contributions to semiconductor technology and his innovative patents have significantly impacted the field. His work continues to influence the development of electronic devices, showcasing the importance of innovation in technology.