Hillsboro, OR, United States of America

James Trevor Goulding

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Dell Products Inc.. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James Trevor Goulding. Retrieved from https://idiyas.com/inventor/james-trevor-goulding

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: James Trevor Goulding: Innovator in Integrated Circuit Technology

Introduction

James Trevor Goulding is an inventor based in Sherwood, OR (US). He is known for his innovative work in the field of integrated circuit technology. Although he currently holds no granted patents, his contributions to the industry are noteworthy.

Latest Patent Applications

Goulding has filed several patent applications that showcase his inventive ideas. One of his latest applications is titled "INTEGRATED CIRCUIT PACKAGES WITH DAMPENERS TO REDUCE VIBRATION EFFECTS." This application discloses integrated circuit packages designed with dampeners to mitigate vibration effects. The apparatus includes a substrate, a semiconductor die carried by the substrate, and a dampener that interfaces with a heatsink when thermally coupled to the semiconductor die. Another significant application is "DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS." This application describes an apparatus that includes a chassis, a first heat sink associated with an electronic component, a second heat sink coupled to the first, and damping material positioned near the second heat sink.

Conclusion

James Trevor Goulding is an inventive mind focused on enhancing integrated circuit technology through his latest patent applications. His work aims to improve the performance and reliability of electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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