Atlanta, GA, United States of America

James Robert Adair, Jr


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Celebrating the Innovations of James Robert Adair, Jr.

Introduction

James Robert Adair, Jr. is an innovative inventor based in Atlanta, GA, renowned for his contributions to packaging technology. With a focus on improving efficiency and control in packaging processes, Adair's work has led to a significant advancement in how liquid-containing condiments are packaged.

Latest Patents

Adair holds one patent titled "Heat Seal Die and System and Method for Portion Control Sized Packaging." This invention introduces a heat seal die that incorporates heat tube technology, aimed at controlling the variation of temperature across the die. The patent focuses on developing a method for portion control size packaging for flowable condiments, creating packages that hold between 1 to 5 ounces.

Career Highlights

Adair has made notable strides during his career at Printpack Illinois, Inc., a company recognized for its commitment to packaging innovations. His work on the heat seal die has not only enhanced the efficiency of the packaging process but has also contributed to the overall sustainability of the practices in the industry.

Collaborations

Throughout his career, Adair has collaborated with talented individuals like William Ben Bower and Edward J. Cigallio. These partnerships have fostered a collaborative environment focused on pushing the boundaries of packaging technology and advancing industry standards.

Conclusion

James Robert Adair, Jr.'s innovative spirit and dedication to his craft make him a notable figure in the realm of packaging inventions. His patent highlights the importance of controlling processes in packaging, which ultimately leads to better product offerings. As the industry continues to evolve, inventors like Adair remain at the forefront, driving advancements that shape the future of packaging.

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