James R Shih

Title: Innovations of James R. Shih

Introduction

James R. Shih is a notable inventor based in Cupertino, CA, who has made significant contributions to the field of integrated circuit manufacturing. With a total of 2 patents, his work focuses on enhancing the efficiency and effectiveness of semiconductor processes.

Latest Patents

One of his latest patents is titled "Process for preventing the formation of ring defects." This invention addresses the prevention of undesired defects that occur during the etching of metal interconnect lines on integrated circuits. The process involves applying a thin film, such as an anti-reflective coating (ARC), on a layer of metal before patterning it into interconnects. The ARC, which is typically a nitride layer like titanium nitride, is covered with an oxide layer to facilitate the subsequent photoresist application and patterning.

Another significant patent by Shih is the "Method of forming air gaps for reducing interconnect capacitance." This method enhances the aspect ratio of electrical conductor members by increasing their effective height. It involves forming a thicker layer of conductor material or adding a capping dielectric layer before patterning. The resulting structure is covered by a dielectric layer that creates voids and open spaces, thereby reducing the dielectric constant between the conductors.

Career Highlights

James R. Shih is currently employed at Integrated Device Technology, Inc., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing integrated circuit technology.

Collaborations

Some of his notable coworkers include Shih-Ked Lee and Tsengyou Syau, who have collaborated with him on various projects within the company.

Conclusion

James R. Shih's contributions to integrated circuit manufacturing through his innovative patents demonstrate his expertise and commitment to advancing technology in this field. His work continues to influence the development of more efficient semiconductor processes.