Janesville, WI, United States of America

James R Kallenbach

This inventor holds 1 USPTO granted patent. Top assignee: Prent Corporation. Active years: 1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James R Kallenbach. Retrieved from https://idiyas.com/inventor/james-r-kallenbach

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 1990

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1 patent (USPTO):Explore Patents

Title: Innovations by James R Kallenbach

Introduction

James R Kallenbach is an accomplished inventor based in Janesville, WI (US). He has made significant contributions to the field of packaging through his innovative designs. His work primarily focuses on creating efficient and user-friendly packaging solutions.

Latest Patents

Kallenbach holds a patent for a thermoformed package. This invention is a one-piece thermoformed plastic package blank that features complementary first and second portions connected by a hinge. The design includes a flange surrounding the portions and the hinge, which is engineered for optimal functionality. The hinge's central zone is at its maximum height above the flange plane, tapering off to zero height at its ends. This unique design allows for smooth folding from open-mode to closed-mode without excessive force.

Career Highlights

Kallenbach is associated with Prent Corporation, where he applies his expertise in packaging innovations. His work has contributed to the development of advanced packaging solutions that enhance product safety and usability. His patent reflects his commitment to improving packaging technology.

Conclusion

James R Kallenbach's innovative approach to packaging design has led to the creation of a patented thermoformed package that exemplifies efficiency and user-friendliness. His contributions continue to influence the packaging industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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