Company Filing History:
Years Active: 2023-2024
Title: James Munger: Innovator in Chip Scale Packaging
Introduction
James Munger is a notable inventor based in Austin, TX, who has made significant contributions to the field of chip scale packaging. With a total of two patents to his name, Munger has demonstrated his expertise and innovation in this specialized area of technology.
Latest Patents
Munger's latest patents focus on a chip scale package (CSP) design. The first patent describes a CSP comprising a first set of contact balls or bumps, a second set of contact balls or bumps, and a channel routing region that is devoid of any CSP contact balls or bumps. This innovative design aims to enhance the efficiency and functionality of chip scale packages.
Career Highlights
James Munger is currently employed at Cirrus Logic Inc., where he continues to develop and refine his inventions. His work at Cirrus Logic has positioned him as a key player in the advancement of chip scale packaging technology.
Collaborations
Munger has collaborated with talented individuals such as Craig McAdam and Jonathan Taylor, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
James Munger's contributions to chip scale packaging through his patents and work at Cirrus Logic Inc. highlight his role as an influential inventor in the technology sector. His innovative designs are paving the way for advancements in the field.