Guilford, CT, United States of America

James M Popplewell

This inventor holds 23 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Olin Corporation, Swiss Aluminium Ltd., Advanced Interconnect Technologies Limited. Active years: 1976-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James M Popplewell. Retrieved from https://idiyas.com/inventor/james-m-popplewell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 11

Forward Citations = 559(Granted Patents)


Company Filing History:


Years Active: 1976-2001

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Areas of Expertise:
Metal Package
Semiconductor Package
Heat Spreader
Aluminum Alloy
Corrosion Resistant
Heat Exchanger
Solar Energy Collector
Brazed Assemblies
Composite Materials
Metal Electrodes
Heavy Metal Removal
Aqueous Fluids
23 patents (USPTO):Explore Patents

Title: James M. Popplewell: Innovator in Electronic Packaging Technology

Introduction

James M. Popplewell, based in Guilford, CT, is a prominent inventor with an impressive portfolio of 23 patents. His innovative contributions primarily focus on advancements in electronic packaging technology, showcasing his expertise in engineering and material science.

Latest Patents

Among his latest patents is the "Edge Connectable Metal Package," which introduces an edge-connectable electronic package featuring a metallic base partially coated with a dielectric layer. This design includes an interconnection means that can take the form of either a leadframe or a circuit trace, electrically linking an encased semiconductor device to the package's perimeter for seamless external connections. Additionally, Popplewell has developed a "Molded Plastic Semiconductor Package Including Heat Spreader," which enhances thermal dissipation. This molded plastic electronic package incorporates a thermal dissipator, such as a heat spreader or heat slug, that is partially encapsulated in the molding resin, improving the overall thermal management of electronic devices.

Career Highlights

Throughout his career, Popplewell has made significant strides in his field, working with notable companies such as Olin Corporation and Swiss Aluminium Ltd. His roles in these organizations have allowed him to apply his innovative ideas and contribute to the development of cutting-edge electronic packaging solutions.

Collaborations

James has had the opportunity to work alongside esteemed colleagues like William H. Anthony and Andrew J. Brock. Their collaborative efforts have undoubtedly enriched the inventive processes within their respective projects, leading to notable advancements in electronic packaging.

Conclusion

James M. Popplewell's contributions to electronic packaging technology exemplify his dedication to innovation. With a robust patent portfolio and a history of collaboration, he continues to inspire the next generation of inventors and engineers in the field. His work signifies the importance of advancing technology in achieving greater efficiency and effectiveness in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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