Olin Corporation

Swiss Aluminium Ltd.

Advanced Interconnect Technologies Limited

James M Popplewell

William H Anthony

Andrew J Brock

Deepak Mahulikar

Michael J Pryor

Sheldon H Butt

Jeffrey S Braden

John F Bates

Constance F Acton

Derek E Tyler

Paul R Hoffman

Alexander F Beck

Martin H Dempsey

There is provided an edge connectable electronic package. The package has a metallic base at least partially coated with a dielectric layer. An interconnection means taking the form of either a leadframe or a circuit trace is electrically interconnected to an encased semiconductor device. The opposing end of the interconnection means extends to the package perimeter for interconnection to a socket or brazing to external leads.

Edge connectable metal package

There is provided a molded plastic electronic package having improved thermal dissipation. A thermal dissipator, such as a heat spreader or a heat slug is partially encapsulated in the molding resin. The thermal dissipator has a density less than that of copper and a coefficient of thermal conductivity that is constant or increases as the package periphery is approached.

Molded plastic semiconductor package including heat spreader

The present invention relates to a packagae adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than cooper based packages and better thermal conductivity than plastic based packages.

Aluminum alloy semiconductor packages

The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

The present invention relates to a package adapted to house an electronic device, such as a semiconductor integrated circuit. The package components are comprised of aluminum or an aluminum based alloy. At least a portion of the surfaces of the package components are anodized to enhance corrosion resistance and increase bond strength. The aluminum based packages are characterized by lighter weight than copper based packages and better thermal conductivity than plastic based packages.

The system comprises a plurality of on-line cleaning tanks, through which continuous metal strip is passed, and a plurality of storage tanks, each containing a different cleaning solution. Different combinations of cleaning solutions are transferred to the on-line tanks from the storage tanks by selecting a particular combination or sequence of cleaning solutions in accordance with the type or composition of metal or metal alloy comprising the strip and automatically feeding the cleaning solutions to the on-line tanks in accordance with the sequence selected. The on-line tanks and storage tanks are interconnected by a network of conduits, pumps and valves which are automatically conditioned by a control element to operate in response to the selection of a particular cleaning sequence. Upon completion of a cleaning operation, each of the solutions is returned to its corresponding storage tank.

System for cleaning metal strip

A multiple passage metal heat exchanger is disclosed which contains a metal barrier between sets of passageways. The barrier is cathodic to the metal of the heat exchanger and prevents intermixing of different heat transfer fluids due to corrosion.

Fail safe heat exchanger

An aluminum composite is provided having improved resistance to intergranular corrosion, especially a brazed aluminum composite. The composite comprises an aluminum base alloy core clad with a brazing alloy consisting essentially of from 4-14% silicon, from 0.01-2% tin, and the balance essentially aluminum. The additions to the brazing alloy reduce the tendency for the brazing alloy layer to induce intergranular corrosion of the core alloy layer. They also reduce the pitting rate of the brazing alloy layer.

Al-Si-Sn Alloy clad composite

A triclad composite aluminum article having increased resistance to crevice corrosion in aqueous environments is disclosed in which a brazing composite having an aluminum core clad on one side with an aluminum brazing alloy is provided on the other side with a sacrificial clad consisting essentially of from 0 to 0.1% magnesium, 0.8 to 1.2% manganese, 0 to 0.1% chromium, 0 to 0.05% silicon, 0 to 0.05% copper, 0.1 to 0.4% zinc, 0 to 0.1% titanium, 0 to 0.1% iron, balance essentially aluminum.

Crevice-corrosion resistant aluminum radiator triclad composite

An alloy system is disclosed which is particularly useful for heat exchanger and water tubing applications. This alloy system utilizes additions of zinc, nickel and iron to a copper base. Cobalt and manganese may also be added to the alloy and such elements as arsenic, antimony and phosphorus may be added as parting inhibitors to the system.

Corrosion resistant copper base alloys for heat exchanger tube

An aluminum composite is provided having improved resistance to intergranular corrosion, especially a brazed aluminum composite. The composite comprises an aluminum base alloy core clad with a brazing alloy consisting essentially of from 4-14% silicon, from 0.01-2% of a material selected from the group consisting of indium, gallium and mixtures thereof, and the balance essentially aluminum. The additions to the brazing alloy reduce the tendency for the brazing alloy layer to induce intergranular corrosion of the core alloy layer. They also reduce the pitting rate of the brazing alloy layer.

Al-Si-In/Ga alloy clad composite

An alloy system is disclosed which is particularly useful for heat exchanger and potable water tubing applications. This alloy system utilizes additions of nickel, tin and manganese in a copper base with the optional addition of aluminum. Such elements as arsenic, antimony and phosphorus may be added as parting inhibitors to this system.

The invention relates to an improved method for removing corrosive heavy metal ions from aqueous fluids used in heat exchange systems. The method provides for the employment of a getter upstream of a heat exchange and in proximate contact therewith so that the getter removes said ions from said fluid before the fluid is introduced into the heat exchanger.

Process for removing heavy metal ions from aqueous fluids

The invention relates to an improved aqueous solar energy collector system which includes a heat exchange panel wherein a getter having a surface layer in contact with the aqueous fluid which is characterized by a high affinity for corrosive metal ions in the aqueous fluid is provided upstream of the heat exchangers to thereby remove said corrosive ions from the aqueous fluid before it is introduced into the heat exchanger.

Growing community of inventors

Guilford, CT, United States of America

James M Popplewell