This inventor holds 1 USPTO granted patent. Top assignee: Sun Microsystems, Inc.. Active years: 1994.
Company Filing History:
Years Active: 1994
Title: The Innovative Contributions of James LaGassa
Introduction
James LaGassa is a notable inventor based in Cupertino, California. He has made significant contributions to the field of integrated circuits, particularly through his innovative patent. His work has had a lasting impact on the efficiency and manufacturing of electronic components.
Latest Patents
LaGassa holds a patent for a "Heat sink and cover for tab integrated circuits." This invention provides an apparatus that includes a heat sink and protective cover for a Tape Automated Bonding (TAB) integrated circuit mounted on a printed circuit board. The design features a printed circuit board with multiple thermal vias drilled through it. The TAB integrated circuit is positioned over these thermal vias, which effectively draw heat generated by the circuit to the opposite side of the board. A heat sink is then placed over the thermal vias to dissipate the heat, held in place by a spring clip that attaches to a molded plastic cover over the TAB integrated circuit. This apparatus is not only easy to manufacture but also efficiently manages heat dissipation for TAB integrated circuits.
Career Highlights
James LaGassa has worked at Sun Microsystems, Inc., where he has been able to apply his innovative ideas in a practical setting. His experience in the industry has allowed him to develop solutions that address real-world challenges in electronics.
Collaborations
Throughout his career, LaGassa has collaborated with talented individuals such as Erich H. Selna and Ehsan Ettehadieh. These collaborations have contributed to the advancement of technology in the field of integrated circuits.
Conclusion
James LaGassa's contributions to the field of integrated circuits through his innovative patent demonstrate his commitment to improving electronic component efficiency. His work continues to influence the industry and inspire future innovations.