Company Filing History:
3 out of 10 
1 out of 12 
1 out of 212 Years Active: 1999-2002
Title: Innovations of James L Lykins
Introduction
James L Lykins is a notable inventor based in San Jose, CA (US). He holds a total of 5 patents that contribute significantly to the field of high-density interconnect printed wiring board substrates. His work focuses on methods that enhance the reliability and performance of electronic components.
Latest Patents
One of Lykins' latest patents is titled "Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates." This invention provides a method for controlling mechanical stresses at the interfaces of metal and dielectric materials in printed wiring substrates. It minimizes cracking due to these stresses through an economically attractive process that meets the demands of modern high-density interconnect applications. The method involves forming a composite dielectric layer over a patterned conductive layer, which includes particles to reduce the likelihood of cracks propagating through the layer.
Another significant patent is the "Method and structure for detecting open vias in high density interconnect substrates." This method tests for open circuits on a common circuit base with pads for electrical contact. It includes steps such as forming a seed layer, patterning a photoresist layer, and inspecting the plated conductive layer for open circuits. This innovation enhances the reliability of interconnect structures in electronic devices.
Career Highlights
James Lykins has worked with several prominent companies, including Kulicke & Soffa Holdings, Inc. and Micromodule Systems, Inc. His experience in these organizations has allowed him to develop and refine his innovative techniques in the field of electronics.
Collaborations
Throughout his career, Lykins has collaborated with notable professionals such as David J Chazan and Jan I Strandberg. These collaborations have contributed to the advancement of his inventions and the overall progress in the industry.
Conclusion
James L Lykins is a distinguished inventor whose contributions to high-density interconnect technology have made a significant impact. His innovative patents and career achievements reflect his dedication to advancing the field of electronics.