Evanston, IL, United States of America

James L Hedrick, Iii

USPTO Granted Patents = 7 

 

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2018-2025

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7 patents (USPTO):Explore Patents

Title: Innovations of James L Hedrick, III

Introduction

James L Hedrick, III is a prominent inventor based in Evanston, IL. He has made significant contributions to the field of three-dimensional printing, holding a total of seven patents. His work focuses on innovative methods and apparatuses that enhance the fabrication of three-dimensional objects.

Latest Patents

Hedrick's latest patents include a method for the fabrication of three-dimensional objects and an apparatus for the same. This method involves techniques that utilize a dewetting phase and a polymerization liquid that are immiscible, allowing for the formation of three-dimensional objects without requiring a dead zone. Additionally, he has developed methods and apparatuses that incorporate an optically transparent cooling apparatus to mitigate heat generated during the fabrication process. Another notable patent is for rapid, large volume, dead layer-free 3D printing, which also employs a dewetting material and a polymerization liquid that are immiscible. This innovation further enhances the efficiency of 3D printing by reducing interfacial adhesive forces.

Career Highlights

James L Hedrick, III is affiliated with Northwestern University, where he continues to advance his research and development in the field of 3D printing technologies. His work has positioned him as a key figure in the innovation of fabrication methods.

Collaborations

Hedrick has collaborated with notable colleagues, including Chad A Mirkin and David Alan Walker, contributing to the advancement of their shared research interests.

Conclusion

James L Hedrick, III is a distinguished inventor whose innovative patents in three-dimensional printing are shaping the future of fabrication technologies. His contributions are significant in enhancing the efficiency and capabilities of 3D printing processes.

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