Endicott, NY, United States of America

James K Lake

USPTO Granted Patents = 9 

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 100(Granted Patents)


Company Filing History:


Years Active: 1994-2017

Loading Chart...
9 patents (USPTO):Explore Patents

Title: Innovations of James K Lake

Introduction

James K Lake is a notable inventor based in Endicott, NY (US), recognized for his contributions to electronic packaging and soldering technologies. With a total of nine patents to his name, Lake has made significant advancements in the field of electronics.

Latest Patents

One of his latest patents is for an electronic package mounting system. This invention involves an assembly and method for securely mounting an electronic package to a printed circuit board (PCB). The design includes a gasket that fits tightly around the perimeter edge of the electronic package, ensuring that electrical contacts on the underside of the package connect properly with PCB contacts. The gasket serves to protect these contacts from contamination, enhancing the reliability of the electronic assembly.

Another significant patent by Lake is the thin film solder paste deposition method and tools. This innovative process allows for the precise application of solder paste onto chip elements or irregular surfaces using a thin porous sheet. The solder paste fills the open areas of the sheet, and when placed in compression against the target surface, it enables accurate solder deposition. This method is particularly beneficial for manufacturing discrete electronic devices, ensuring high-quality solder connections between curved surfaces.

Career Highlights

Throughout his career, James K Lake has worked with prominent companies such as IBM and Lockheed Martin Corporation. His experience in these leading organizations has contributed to his expertise in electronic packaging and soldering technologies.

Collaborations

Lake has collaborated with notable individuals in the field, including Randy C Long and Stephen G Gonya. These partnerships have likely fostered innovation and the exchange of ideas in their respective projects.

Conclusion

James K Lake's contributions to electronic packaging and soldering methods have significantly impacted the industry. His innovative patents and career achievements reflect his dedication to advancing technology in electronics.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…