The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 11, 2017

Filed:

Jul. 17, 2013
Applicant:

Lockheed Martin Corporation, Bethesda, MD (US);

Inventors:

Tom Rovere, Binghamton, NY (US);

James K. Lake, Endicott, NY (US);

Rick Micha, Johnson City, NY (US);

Paul Coyne, Endicott, NY (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MD (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 3/30 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/301 (2013.01); H05K 3/3436 (2013.01); H05K 2201/2018 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/1147 (2013.01); Y10T 29/4913 (2015.01);
Abstract

An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package. The electronic package may be carried by the PCB and comprise electrical package contacts on an underside of the package, which contact PCB contacts on the PCB. The gasket may be disposed between the underside of the package and the PCB substrate and surround the contacts, and may be shaped to fit around and under a perimeter edge of the package to protect the contacts from contamination.


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