This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2002.
Company Filing History:
Years Active: 2002
Title: James Hennekens: Innovator in Integrated Circuit Removal Methods
Introduction
James Hennekens is a notable inventor based in Marlboro, NY (US). He has made significant contributions to the field of integrated circuit technology. His innovative methods for removing integrated circuits from substrates have garnered attention in the industry.
Latest Patents
Hennekens holds a patent for a "Method and apparatus for removing known good die." This patent outlines preferred embodiments for methods of removing an integrated circuit (IC) from a substrate, where the IC is attached by multiple solder connections. One embodiment involves heating the IC and substrate to the reflow temperature for the solder connections and using a vacuum force to pull the IC from the substrate. Another embodiment describes shearing the IC from the substrate after heating, but before reaching the solder reflow temperature, with a shearing force that can be controlled by a computer-controlled servomotor. The patent also includes apparatus designs that utilize these methods, such as a vented pallet that applies vacuum force without physical clamping.
Career Highlights
James Hennekens is associated with International Business Machines Corporation (IBM), where he has contributed to various projects related to integrated circuits. His work has been instrumental in advancing the technology used in electronic devices.
Collaborations
Hennekens has collaborated with notable coworkers, including Lannie R Bolde and Gregory M Johnson. Their combined expertise has contributed to the development of innovative solutions in the field.
Conclusion
James Hennekens is a distinguished inventor whose work in integrated circuit removal methods has made a significant impact on the industry. His innovative approaches continue to influence the technology landscape.