This inventor holds 1 USPTO granted patent. Top assignee: Sigmaform Corporation. Active years: 1989.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1989
Title: James H Reynolds: Innovator in Electrical Connections
Introduction
James H Reynolds is a notable inventor based in Santa Clara, CA (US). He has made significant contributions to the field of electrical connections, particularly through his innovative designs and methods.
Latest Patents
One of his key patents is the "Backshell assembly and method." This invention discloses a backshell assembly and a method for making and assembling a connection between an electrical cable and another electrical device. The backshell assembly features a hollow cylindrical body with a first end designed for attachment to the other electrical device. Additionally, it includes a hollow cylindrical nut for attachment to the other end of the backshell body, allowing for the entrance of the cable. A hollow cylindrical heat shrinkable tube is also part of the assembly, with its central portion shrunk down and bonded to the nut. The end extensions are stress relieved by being heat shrunk, providing an inside diameter greater than the diameter of the outside surface of the nut. This innovative design enhances the reliability and efficiency of electrical connections.
Career Highlights
James H Reynolds is associated with Sigmaform Corporation, where he has been able to apply his inventive skills. His work has led to advancements in the field of electrical engineering, particularly in the area of connection assemblies.
Collaborations
Throughout his career, James has collaborated with talented individuals such as Susan L Stene and Gary L Dibble. These collaborations have contributed to the development of innovative solutions in electrical connections.
Conclusion
James H Reynolds is a distinguished inventor whose work in electrical connections has made a significant impact. His patent for the backshell assembly showcases his innovative approach to solving complex engineering challenges. His contributions continue to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile