Gonzales, TX, United States of America

James E Herbold


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2008

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1 patent (USPTO):Explore Patents

Title: Innovations of James E. Herbold in Circuit Substrate Technology

Introduction

James E. Herbold is an accomplished inventor based in Gonzales, TX (US). He has made significant contributions to the field of circuit substrate technology, particularly in the area of solder removal methods. His innovative approach has led to the development of a unique patent that addresses common challenges in the electronics manufacturing process.

Latest Patents

James E. Herbold holds a patent for a method titled "Vertical removal of excess solder from a circuit substrate." This invention involves the use of a sacrificial circuit substrate that features a plurality of pads and vias designed to be solder-wettable. The process entails placing the sacrificial substrate in close proximity to the excess solder on the circuit substrate. By heating the excess solder until it becomes liquid, the solder is wicked vertically onto the pads and into the vias of the sacrificial substrate. Once the solder is in a liquid state, the sacrificial substrate is lifted away, taking the excess solder with it while leaving a predetermined amount on the original circuit substrate. This method enhances the efficiency of solder removal in electronic manufacturing.

Career Highlights

James E. Herbold is currently employed at Temic Automotive of North America, Inc., where he continues to innovate in the field of electronics. His work has not only contributed to the advancement of circuit substrate technology but has also improved manufacturing processes within the automotive industry.

Collaborations

Throughout his career, James has collaborated with notable colleagues, including William C. Weigler and Robert Babula. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

James E. Herbold's contributions to circuit substrate technology exemplify the impact of innovative thinking in the electronics industry. His patented method for solder removal showcases his commitment to improving manufacturing processes. Through his work at Temic Automotive of North America, Inc., he continues to push the boundaries of technology and innovation.

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